MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202514106937 A) filed by Samsung Electronics Co. , Ltd. on November 04, 2025, for Semiconductor Package And Method Of Manufacturing The Same.
Inventor includes Young Kun Jee --.
The application for the patent was published on August 28, 2026, under issue no. 35/2026.
Abstract: A semiconductor package a includes a first semiconductor chip, a plurality of second semiconductor chips stacked on the first semiconductor chip, and a third semiconductor chip on the second semiconductor chips, and an adhesive layer between the third semiconductor chip and an uppermost second semiconductor chip of the second semiconductor chips. The second semiconductor chips...