Intellectual Property India Publishes Patent Application for Semiconductor Device With Wrap-Around Contact Having Non-Uniform Thickness

MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647081078 A) filed by International Business Machines on July 01, 2026, for Semiconductor Device With Wrap-Around Contact Having Non-Uniform Thickness.

Inventors include Abedin, Minhaz; Li, Tao; Xie, Ruilong; and Gluschenkov, Oleg.

The application for the patent was published on July 03, 2026, under issue no. 27/2026.

Abstract: A semiconductor device is provided. The semiconductor device includes a nanosheet stack disposed on a substrate. The semiconductor device also includes a source/drain epitaxial layer disposed on the substrate adjacent to the nanosheet stack. The semiconductor device also includes a source/drain contact formed in contact wit...