MUMBAI, India, Oct. 19 -- Intellectual Property India has published a patent application (202647120789 A) filed by Qualcomm Incorporated on October 08, 2026, for Semiconductor Device Package With Lid.
Inventors include Yao, Wei; and Dhandapani, Karthikeyan.
The application for the patent was published on October 16, 2026, under issue no. 42/2026.
Abstract: In an aspect, an apparatus may include a lid and a package substrate. The package substrate may include a first metallization structure on a substrate core and an embedded lid support structure disposed on a perimeter of the first metallization structure in the package substrate. The lid is coupled to the substrate core through the embedded lid support structure.
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