MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202617069754 A) filed by Arcelormittal on June 03, 2026, for Sandwich Panel And Building Envelope Thereof.
Inventors include Begue, Olivier; Vignal, Renaud Intellectual; and Descazeaux, Mdric.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: The invention relates to a sandwich panel comprising a photovoltaic active area positioned on the outer sheet and whose upper, respectively lower, electrical connector is positioned in an upper, respectively lower, cavity, the upper cavity being positioned within the insulation material in the upper half of the sandwich panel, the lower cavity being positioned with...