MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202647105120 A) filed by Xiamen Hongfa Electric Power Controls Co. , Ltd. on September 01, 2026, for Relay.
Inventors include Dai, Wenguang; Wu, Zhuxiong; Zhong, Shuming; and Chen, Songsheng.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The present application relates to a relay, comprising an insulating cover, a pair of static contacts, and a movable contact blade, wherein the insulating cover is provided with an inner cavity, and the insulating cover is further provided with a pair of mounting holes communicated with the inner cavity; each static contact is provided with an extending part,...