MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202617086165 A) filed by Probiusdx, Inc. on July 14, 2026, for Providing An Environmental Access/Sampling Port To A Semiconductor Die.
Inventor includes Hui, Jeremy.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: A laminated substrate defines a hole there through. The laminated substrate includes a core including a first biologically inert material, and a first conductive layer adjacent to the core. A gasket includes a second biologically inert material. The gasket extends from a lower side of the laminated substrate. The gasket defines a portion of the hole. The gasket is configured to abut a...