MUMBAI, India, June 22 -- Intellectual Property India has published a patent application (202631012206 A) filed by Ekokul Pvt. Ltd. on February 04, 2026, for Prefabricated Integrated Thermal Insulation Board.
Inventor includes Mr. Kausikbrata Maiti.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: Prefabricated integrated thermal insulation board The present invention relates to a prefabricated, unitary integrated polymeric composite thermal-insulation board and a method for manufacturing the same. The insulation board comprises an insulating core including expanded polystyrene (EPS) foam, an expandable polymer matrix formed by a two-component hard rigid polyurethane foam, a first substrat...