Intellectual Property India Publishes Patent Application for Pouch Comprising A Film With A Layered Structure And Method For Producing The Same

MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202614019184 A) filed by Sig Services AG on February 19, 2026, for Pouch Comprising A Film With A Layered Structure And Method For Producing The Same.

Inventors include Uribe Soto, Luis Fernando; Perini Bortolo, Otvio; and Santini Torres, Luis Alberto.

The application for the patent was published on October 02, 2026, under issue no. 40/2026.

Abstract: A container for accommodating a product, wherein the container comprises a. an interior volume, b. a first sidewall comprising a film, wherein the film comprises a layered structure, wherein a cross-sectional cut of the film comprises at least five layers, wherein the at least five layers are arranged i...