MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202531030286 A) filed by Siksha O Anusandhan Deemed To Be University on March 28, 2025, for Pipe Joint Bonding Assistive Device.
Inventor includes Dr. Lasyamayee Garanayak.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: A pipe joint bonding assistive device comprises of, a platform 101 configured to be positioned on one of a pair of metal pipes to be joined, a plurality of suction cups 102 is arranged on a lower portion of platform 101 for securing platform 101, a microphone 103 installed in platform 101 that is accessed by a user for providing input voice commands, an imaging unit 104 paired with...