Intellectual Property India Publishes Patent Application for Physical Layer Preamble And Signaling For Wireless Communication

MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202548111473 A) filed by Qualcomm Incorporated on November 14, 2025, for Physical Layer Preamble And Signaling For Wireless Communication.

Inventors include Chen, Jialing Li; Vermani, Sameer; Yang, Lin Number; Tian, Bin; Jones, Iv, Vincent Knowles; and Kim, Youhan Filed On.

The application for the patent was published on July 10, 2026, under issue no. 28/2026.

Abstract: ABSTRACT PHYSICAL LAYER PREAMBLE AND SIGNALING FOR WIRELESS COMMUNICATION This disclosure provides methods, devices and systems for wireless communication, and particularly, methods, devices and systems for including signaling regarding enhanced features of new wireless communication...