Intellectual Property India Publishes Patent Application for Perimeter And Infill Optimizations For Liquid Metal Jetting 3d Printing

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202627000323 A) filed by Additive Technologies, LLC Dba Additec on January 02, 2026, for Perimeter And Infill Optimizations For Liquid Metal Jetting 3d Printing.

Inventors include Liu, Chu-Heng; Guggilapu, Priyaankadevi; and Mcconville, Paul J..

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: A method for printing a 3D part with a 3D printer includes ejecting drops of a build material from a nozzle of the 3D printer. A first plurality of the drops forms a perimeter of the 3D part, and a second plurality of the drops forms an infill of the 3D part. The method also includes controlling a parameter su...