MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617075956 A) filed by Ranpak Corp. on June 19, 2026, for Packaging System And Method For Expandable Padded Mailers.
Inventors include Welten, Johannes Egbertus Gerardus; and Jacobs, Jannick Henric Marie.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: A packaging system that enables a packer to open a packaging envelope with one hand and insert an item to be packaged before removing the packaging envelope and closing the packaging envelope for shipment. The packaging system includes an envelope support assembly configured to support an upright stack of a plurality of packaging envelopes, and a cap...