Intellectual Property India Publishes Patent Application for Package Substrate With Embedded Capacitor Package Having Redistribution Layer(s) (rdl(s)) For Aligning Capacitor Terminals Connections To Semiconductor Die In An Integrated Circuit (ic) Package, And Related Fabrication Methods

MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647058815 A) filed by Qualcomm Incorporated on May 08, 2026, for Package Substrate With Embedded Capacitor Package Having Redistribution Layer(s) (rdl(s)) For Aligning Capacitor Terminals Connections To Semiconductor Die In An Integrated Circuit (ic) Package, And Related Fabrication Methods.

Inventors include Patil, Aniket; Buot, Joan Rey Villarba; and Gupta, Piyush.

The application for the patent was published on June 26, 2026, under issue no. 26/2026.

Abstract: Package substrate with embedded capacitor package with a redistribution layer(s) (RDL(s)) for aligning capacitor terminals to die interconnects of a semiconductor die ("die") in an integ...