MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088268 A) filed by Qualcomm Incorporated on July 20, 2026, for Package Substrate With A Reserve Capacitor.
Inventors include We, Hong Bok; Kim, Michelle Yejin; and Kang, Kuiwon.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: In an aspect, an IC device may include a base substrate including an embedded component and a first metallization structure. The first metallization structure includes a plurality of first metal layers, a plurality of first dielectric layers, a plurality of first vias configured to couple adjacent metal layers of the plurality of first metal layers through the plurality of...