Intellectual Property India Publishes Patent Application for Package Comprising Substrates, Integrated Devices And A Heat Sink

MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088780 A) filed by Qualcomm Incorporated on July 21, 2026, for Package Comprising Substrates, Integrated Devices And A Heat Sink.

Inventors include Li, Yue; Yu, Youmin; Lane, Ryan; Gupta, Piyush; and Wu, Wei.

The application for the patent was published on July 24, 2026, under issue no. 30/2026.

Abstract: A package comprising a first substrate; a first integrated device coupled to the first substrate; a second substrate; a second integrated device coupled to the second substrate; and a heat sink coupled to the second substrate, wherein the heat sink vertically overlaps with at least part of the first integrated device, and wherein the heat sin...