Intellectual Property India Publishes Patent Application for Package Comprising A Trench Capacitor Device With A Metallization Portion Comprising Bar Metallization Interconnects

MUMBAI, India, Oct. 19 -- Intellectual Property India has published a patent application (202647120702 A) filed by Qualcomm Incorporated on October 08, 2026, for Package Comprising A Trench Capacitor Device With A Metallization Portion Comprising Bar Metallization Interconnects.

Inventors include Patil, Aniket; Aldrete, Manuel; and Gupta, Piyush.

The application for the patent was published on October 16, 2026, under issue no. 42/2026.

Abstract: A package comprising a substrate; and a passive device coupled to the substrate through at least a first plurality of solder interconnects. The passive device comprises a trench capacitor device; an encapsulation layer; and a metallization portion coupled to the trench capacitor device and the en...