Intellectual Property India Publishes Patent Application for Package Comprising A Substrate Including An Inter Substrate Interconnect Structure Comprising An Inner Interconnect

MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077885 A) filed by Qualcomm Incorporated on June 24, 2026, for Package Comprising A Substrate Including An Inter Substrate Interconnect Structure Comprising An Inner Interconnect.

Inventors include Patil, Aniket; Buot, Joan Rey Villarba; and Aldrete, Manuel.

The application for the patent was published on July 03, 2026, under issue no. 27/2026.

Abstract: A package comprising a first substrate; an integrated device coupled to the first substrate through at least a first plurality of solder interconnects; an inter substrate interconnect structure coupled to the first substrate through at least a second plurality of solder interconnects. The inter...