Intellectual Property India Publishes Patent Application for Package Comprising A Substrate And A Passive Device

MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077445 A) filed by Qualcomm Incorporated on June 23, 2026, for Package Comprising A Substrate And A Passive Device.

Inventors include Patil, Aniket; Aldrete, Manuel; and Gupta, Piyush.

The application for the patent was published on July 03, 2026, under issue no. 27/2026.

Abstract: A package comprising a substrate comprising a first surface and a second surface, wherein the substrate further comprises: at least one dielectric layer; and a plurality of interconnects; an integrated device coupled to the first surface of the substrate through at least a first plurality of solder interconnects; and a passive device coupled to the second surface of ...