Intellectual Property India Publishes Patent Application for Package Comprising A Package Interposer And A Lid Frame With An Opening

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647127990 A) filed by Qualcomm Incorporated on October 27, 2026, for Package Comprising A Package Interposer And A Lid Frame With An Opening.

Inventors include Song, Yanmei; Huang, Jingyi; Yun, Sun Woong; and Stone, William.

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: A device comprising a substrate; a package coupled to the substrate, a second integrated device coupled to the substrate; and a lid frame coupled to the substrate, wherein the lid frame comprises an opening located vertically over the second integrated device. The package comprises a package interposer comprising a first metall...