MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077995 A) filed by Qualcomm Incorporated on June 24, 2026, for Package Comprising A Bridge With Spring Pads.
Inventors include Sun, Yangyang; He, Dongming; and Li, Zhaozhi.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: A package comprising a substrate; a first integrated device coupled to the substrate through at least a first plurality of solder interconnects; a second integrated device coupled to the substrate through at least a second plurality of solder interconnects; and a bridge coupled to the substrate, wherein the bridge comprises a plurality of spring pads.
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