Intellectual Property India Publishes Patent Application for Multiple Independent On-Chip Interconnect

MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202615071205 A) filed by Apple Inc. on June 08, 2026, for Multiple Independent On-Chip Interconnect.

Inventors include Kolor, Sergio; Tota, Sergio V.; Zemer, Tzach; Lahav, Sagi; Redshaw, Jonathan M.; Hammarlund, Per H.; Tamari, Eran; Vash, James; Garg, Gaurav; Zimet, Lior; Kaushikkar, Harshavardhan Filed On; Fishwick, Steven; Hutsell, Steven R.; and Fukami, Shawn M..

The application for the patent was published on July 10, 2026, under issue no. 28/2026.

Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a plurality of agents and a plurality of network switc...