MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202617065971 A) filed by Pregis LLC on May 25, 2026, for Multilayer Embossments With Strain-Relief Features.
Inventor includes Wetsch, Thomas, D..
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: Multi-layer packaging articles can include embossments formed on each layer. The packaging articles can be formed from multi layer webs. An embossing device can locally deform one of the web layers into another, overlying web layer to form the embossments. The webs can include features that permit the web material to be deformed with little, or no tearing of the web material.
Disclaimer: Curated by HT ...