MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202611099296 A) filed by Noida International University on August 17, 2026, for Modular Fan-Shaped Coolant Nozzle Array With Interlocking Ring Assembly.
Inventors include Pradyut Anand; Suresh Pratap; Mohit Aggarwal; and Rahul Kumar Singh.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: A modular coolant nozzle array for a computer numerical control machining center comprises a plurality of coolant nozzle elements arranged collectively in a fan- shaped geometry and an interlocking ring assembly for interlocking the coolant nozzle elements. Conventional coolant-delivery arrangements commonly employ ...