MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647076939 A) filed by Henkel AG & Co. Kgaa on June 22, 2026, for Method Of Separating Bonded Articles.
Inventors include Franken, Uwe; Lammerschop, Olaf; Roepert, Marie-Christin; and Lu, Yuzhou.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: The present disclosure is directed to a method for debonding a bonded article, said method comprising the steps of: method for debonding a bonded article, said method comprising the steps of: a) providing a bonded article comprising at least one layer of a first adhesive interposed between two substrate surfaces, said bonded article being further provided with...