MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647092604 A) filed by Resonac Corporation on July 30, 2026, for Method For Manufacturing Substrate With Conductive Via, Substrate With Conductive Via, Method For Manufacturing Circuit Board With Conductive Via, And Circuit Board With Conductive Via.
Inventors include Ejiri Yoshinori; Sakamoto Masumi; Shimizu Chiaki; Oikawa Futoshi; Uragami Hiroshi; Kai Seiji; Morijiri Tomoki; Kikuchi Naoyuki; Urashima Kosuke; Kurahashi Shunsuke; Nishimoto Masayoshi; Yokozumi Tomomi; and Akai Kunihiko.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: The objective of the present invention is to provide a method fo...