MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093751 A) filed by Resonac Corporation on August 03, 2026, for Method For Manufacturing Substrate With Conductive Through-Via, Metal Paste, And Substrate With Conductive Through-Via.
Inventors include Ejiri Yoshinori; Sakamoto Masumi; and Shimizu Chiaki.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: Provided is a method for manufacturing a substrate with a conductive through-via, said method comprising: a step (a) of preparing a substrate provided with a hole, and providing a metal paste part containing metal particles and a volatile solvent so as to fill the inside of the hole and cover at...