MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617070581 A) filed by Emitec Technologies Gmbh on June 05, 2026, for Method For Applying Glue To A First Layer, And A Honeycomb Structure.
Inventors include Schmidt, Christian; Schepers, Sven; Voit, Michael; Niedmann, Alf; Hodgson, Jan; and Zaun, Sascha.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The invention relates to a method for applying glue to a first layer (1), which has a wave structure (2), wherein the first layer (1) extends along an extension direction (3) between a first end (4) and a second end (5) and transverse thereto along a width direction (6) between a first end face (7) a...