MUMBAI, India, Nov. 13 -- Intellectual Property India has published a patent application (202641038670 A) filed by Presidency University, Bangalore on March 28, 2026, for Metallic Frame Packaging Device.
Inventor includes Dr. Megala G.
The application for the patent was published on November 13, 2026, under issue no. 46/2026.
Abstract: A metallic frame packaging device, comprising a platform 101, a primary motorized conveyor 102 , a metallic frame is manually placed by a user over the conveyor for transportation and positioning during the packaging operation, an inspection unit 103 determine presence of corrosion or misalignment on the metallic frame, and accordingly a grinding roller 104 grind, smooth, and align the metallic frame surfa...