MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202617068625 A) filed by Cuptronic Technology Ltd. on June 01, 2026, for Metalization Of Surfaces.
Inventors include Gthe, Sven; Atthoff, Bjrn; and Lindelf, Magnus.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: There is disclosed a method for application of a metal on a substrate, comprising the steps of a) providing the substrate which comprises abstractable hydrogen atoms and/or C=C bonds, b) producing a covalently bound negatively charged polymer on the substrate, by a reaction between the surface groups and monomers, wherein chain propagation of a growing polymer chain is carried out to the des...