Intellectual Property India Publishes Patent Application for Memory And Compute 3dic Integration Without Through Silicon Via

MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202647115015 A) filed by Google LLC on September 25, 2026, for Memory And Compute 3dic Integration Without Through Silicon Via.

Inventors include Weng, Li-Sheng; Kim, Chin Kwan; Park, Hee Jun; Hwang, Inho; Yoon, Hongil; and Shah, Milind.

The application for the patent was published on October 02, 2026, under issue no. 40/2026.

Abstract: Methods, systems, and methods of manufacture are described for integrating memory and compute die in a stacked configuration in an integrated circuit package without through silicon via. A packaging apparatus that includes a first semiconductor die comprising multiple memory cells and a second semiconductor die compri...