MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202641108133 A) filed by Pragati Engineering College on September 09, 2026, for Mechanical Package For Recording Cumulative Thermal Exposure During Cold Chain Transportation.
Inventors include Mrs. Aravinda Karri; Mrs. P Gayathri; Mr. A. Phani Bhaskar; and Mr. N Raghuveer.
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: The present invention relates to a Mechanical Package for Recording Cumulative Thermal Exposure During Cold Chain Transportation for monitoring temperature- sensitive products during storage, handling, and transportation. The package comprises an insulated housing enclosing a pa...