MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202617078125 A) filed by Uacj Corporation on June 24, 2026, for Lid Material And Packaging Material.
Inventors include Kato Hisaya; Koishikawa Atsushi; Maeda Tomohiro; and Haga Yohei.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: A lid material 30 for sealing a storage part 21 of a storage container 20 includes: a base material layer 35; a circuit pattern 32 provided on the base material layer 35 and having a wiring route that is broken when the storage part is opened; a resin layer 37 covering the circuit pattern 32 from the side opposite to the base material layer; and a layer 31 for heat a...