MUMBAI, India, Nov. 6 -- Intellectual Property India has published a patent application (202641018383 A) filed by Presidency University, Bangalore on February 18, 2026, for Laminated Wrapping Material Cutting Device.
Inventor includes Dr. Shashikala A R.
The application for the patent was published on November 06, 2026, under issue no. 45/2026.
Abstract: A laminated wrapping material cutting device, comprising a platform 101 accommodating operational components, an input means 102 operatively linked with a microcontroller to enable a user to provide input command regarding initiation of cutting operation of laminated wrapping material, a motorized roller 103 wrapped with a laminated sheet and integrated with a U-shaped frame 104 installe...