Intellectual Property India Publishes Patent Application for Integrated Circuits (ics) Having Separate Signal And Power Distribution Network (pdn) Interconnect Structures For Reduced Power Signal Routing Congestion And Path Lengths, And Related Three- Dimensional (3d) Ics (3dics) And Fabrication Methods

MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088782 A) filed by Qualcomm Incorporated on July 21, 2026, for Integrated Circuits (ics) Having Separate Signal And Power Distribution Network (pdn) Interconnect Structures For Reduced Power Signal Routing Congestion And Path Lengths, And Related Three- Dimensional (3d) Ics (3dics) And Fabrication Methods.

Inventors include Li, Yue; Sun, Yangyang; Popovic, Darko; and Lisk, Durodami.

The application for the patent was published on July 24, 2026, under issue no. 30/2026.

Abstract: Integrated circuits (ICs) having a separate signal and power distribution network (PDN) interconnect structures for reduced power signal routing congestion and path le...