Intellectual Property India Publishes Patent Application for Integrated Circuit (ic) Package Including Two Substrates And Vertical Interconnects Coupling The Two Substrates, The Vertical Interconnects Comprising A Metal Ball And Metal Pin Combination To Address An Increased Distance Between Substrates

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093831 A) filed by Qualcomm Incorporated on August 03, 2026, for Integrated Circuit (ic) Package Including Two Substrates And Vertical Interconnects Coupling The Two Substrates, The Vertical Interconnects Comprising A Metal Ball And Metal Pin Combination To Address An Increased Distance Between Substrates.

Inventors include Wang, Zhijie; Buot, Joan Rey Villarba; and Patil, Aniket.

The application for the patent was published on August 07, 2026, under issue no. 32/2026.

Abstract: Aspects disclosed include an integrated circuit (IC) package including two substrates and vertical interconnects coupling the two substrates, the vertical interconnect...