MUMBAI, India, Oct. 19 -- Intellectual Property India has published a patent application (202644043587 A) filed by Te Connectivity Solutions Gmbh on April 06, 2026, for Insulation Displacement Connector.
Inventors include Ramunno, Thomas; Lord, Steven; and Rouillard, Xavier.
The application for the patent was published on October 16, 2026, under issue no. 42/2026.
Abstract: An insulation displacement connector, an IDC (100) is disclosed, including at least one piercing terminal (110), for penetrating wire insulation and making electrical contact to a respective insulated wire in a wire holder (200); and a closable housing (300). The closable housing includes a cavity (150), for holding the wire holder (200) and the at least one piercing ...