MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202644035369 A) filed by Te Connectivity Solutions Gmbh on March 24, 2026, for Insulating Housing For Providing Heat Insulation And Installation Kit.
Inventors include Heindl, Christian; Kehl, Ladislaus; Lagden, Russell; Ludwiczak-Aron, Magdalena.; and Oliveira, Patricia.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: Insulating housing (100) for providing a heat insulation around a cable (190). The insulating housing (100) comprises a main body (110) having a plurality of longitudinal grooves (111) along a longitudinal axis (102) of the main body (110) and further comprises two peripheral reg...