MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202441102012 A) filed by Stellantis Auto Sas; and Fca Us LLC on December 23, 2024, for Housing Assembly For Printed Circuit Board.
Inventors include Manish Kumar; Ravinder Singh; Shivaprasada Kv; and Jerome Forest.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: HOUSING ASSEMBLY FOR PRINTED CIRCUIT BOARD A housing assembly (1) for a printed circuit board (50) having at least one antenna mounted on comprising an upper housing (10) including at least one first cutout (11), a lower housing including at least one second cutout (22) and a cover (30) fastened to the housing assembly (1) for appropriately s...