Intellectual Property India Publishes Patent Application for Housing Assembly And Method For Manufacturing Housing Assembly

MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202647069027 A) filed by Astemo, Ltd. on June 02, 2026, for Housing Assembly And Method For Manufacturing Housing Assembly.

Inventors include Chiba Kentaro; Murata Daisuke; and Nohara Misato.

The application for the patent was published on June 12, 2026, under issue no. 24/2026.

Abstract: Provided are: a housing assembly with which it is possible to ensure adhesion and sealing performance of a housing and to prevent falling of screws; and a manufacturing method for said housing assembly. In a housing assembly (U), screws (50) are used to fix a housing (200) to one surface (101) of a base body (100). The housing (200) is provided with a housing body ...