MUMBAI, India, Oct. 12 -- Intellectual Property India has published a patent application (202617084936 A) filed by International Business Machines Corporation on July 10, 2026, for High Capacitance Hybrid Bonded Capacitor Device.
Inventors include Polomoff, Nicholas; Farooq, Mukta; Jayanand, Kishan; Latham, Nicholas; Huang, Huai; and Bonam, Ravi.
The application for the patent was published on October 09, 2026, under issue no. 41/2026.
Abstract: Techniques are provided for hybrid bonding metallic bonding pads embedded in high- K dielectric material to form a high capacitance device. For example, a device comprises a first semiconductor structure bonded to a second semiconductor structure, and a plurality of metal pads at an interface por...