Intellectual Property India Publishes Patent Application for High-Bandwidth Memory (hbm) Package-On-Package (pop) Dynamic Random-Access Memory (dram) With Semiconductor Pillars

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647127989 A) filed by Qualcomm Incorporated on October 27, 2026, for High-Bandwidth Memory (hbm) Package-On-Package (pop) Dynamic Random-Access Memory (dram) With Semiconductor Pillars.

Inventors include Badaroglu, Mustafa; Kim, Jonghae; Wang, Zhongze; Kang, Woo Tag; Choi, Jihong; Lee, Hyun; Nallapati, Giridhar; and Chidambaram, Periannan.

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: A system-in-package (SIP) is described. The SIP includes a first package substrate supporting a logic die. The SIP also includes a second package substrate supporting a stack of memory dies. The SIP further inclu...