Intellectual Property India Publishes Patent Application for Foam Mold

MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202644044901 A) filed by Pou Chen Corporation on April 08, 2026, for Foam Mold.

Inventors include Liang-Feng Sun; Chih-Hsien Lin; Huei-Ting Zeng; and Hung-Sheng.

The application for the patent was published on October 23, 2026, under issue no. 43/2026.

Abstract: ABSTRACT FOAM MOLD A foam mold (1000) includes a mold main body (1200), and the mold main body (1200) has a height direction and includes a foam space (S1) and a first core (1220) connected to the foam space (S1). The first core (1220) includes a porous layer (1222, 2241) and a through hole layer (1221, 2242). The porous layer (1222, 2241) faces to the foam space (S1) and is made by a 3D pri...