MUMBAI, India, June 22 -- Intellectual Property India has published a patent application (202641068368 A) filed by Karunya Institute Of Technology And Sciences; and Thermal Systems Group U. R. Rao Satellite Centre Isro on June 01, 2026, for Flexible Heat Pipe With A Stepped Multi-Layered Wick Structure.
Inventors include Dr. A Brusly Solomon; Nidhin A R; R. Jayaseelan; Akhil Jaiswal; Devaraju G; Dr. Anand A R; and Dr. Venkata Raghavendra.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: The present invention relates to a flexible heat pipe (100), comprising a sealed enclosure having an evaporator section (10), an adiabatic section (12), and a condenser section (14); flexible bellows (16) i...