MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202617063950 A) filed by Vanchip Tianjin Technology Co. , Ltd. on May 20, 2026, for Filter And Packaging Method Therefor.
Inventors include Xu, Xian; Feng, Dandan; Lin, Hongkuan; and Zhang, Xinyao.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: Provided in the present invention is a filter packaging method. The filter packaging method comprises: providing a substrate, wherein a resonance structure is formed on the surface of the substrate, the resonance structure comprises a resonance body and electrodes located on two sides of the resonance body, and the surface of each electrode comprises a first ...