MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202617029257 A) filed by The Board Of Trustees Of The University Of Illinois on March 11, 2026, for Faster Automated Iterative C-C Bond Formation.
Inventors include Burke, Martin, D.; Blair, Daniel; Angello, Nicholas; and Wang, Wesley.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: Disclosed is a rapid automated iterative cross-coupling platform that utilizes stable boronate building blocks and isolable boronate ester intermediates. Also disclosed are methods for activating boronate reagents.
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