MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647124187 A) filed by Resonac Corporation on October 16, 2026, for Exterior Material For Power Storage Device, Power Storage Device, And Method For Manufacturing Power Storage Device.
Inventor includes Tomori Naoki.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: This exterior material for a power storage device comprises a barrier layer and a thermocompression bonding layer provided on one or both surfaces of the barrier layer. The thermocompression bonding layer includes a resin layer that does not melt at 250°C or less. The thermocompression bonding layer may include a resin layer containing ...