Intellectual Property India Publishes Patent Application for Enhanced Integrated Circuit Heat Dissipation Using Inactive Metal Lines

MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647077313 A) filed by Qualcomm Incorporated on June 23, 2026, for Enhanced Integrated Circuit Heat Dissipation Using Inactive Metal Lines.

Inventors include Lepaksha, Hithesh Hassan; Nandanwar, Darshan Kumar; and Desai, Kartik Gunvantbhai Number.

The application for the patent was published on July 03, 2026, under issue no. 27/2026.

Abstract: An electronic device includes one or more substrates carrying active circuitry; a heat sink structure; one or more thermal through- substrate vias (TTSVs) forming a first set of one or more thermally conductive paths between the one or more substrates and the heat sink structure; and one or more metallization...