MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202347049439 A) filed by Samsung Electronics Co. , Ltd. on July 21, 2023, for Electronic Device Comprising Housing Assembly Structure.
Inventors include Moon, Heecheul; Kim, Gyeongtae; and Baek, Moohyun.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: An electronic device, according to various embodiments, comprises: a first plate; a second plate; a lateral member which is disposed so as to surround a space between the first plate and the second plate, and comprises a conductive portion, and a nonconductive portion coupled to the conductive portion; a frame member which is coupled along the edges of ...