MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202611116343 A) filed by Chandigarh University on September 29, 2026, for Electromechanical Pop-In Pop-Out Floor System For Non-Electrical Weight, Time-Location Correlation, And Load Reporting.
Inventor includes Pankaj.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The present invention relates to an electromechanical pop-in pop-out floor system 5 for non-electrical weight, time-location correlation, and load reporting. A passive load monitoring device includes a floor-integrated surface structure, an electromechanical pop-in pop-out (EM-PIPO) sensing array, and a mechanical aggregation interface...