MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647081619 A) filed by Henkel AG & Co. Kgaa on July 02, 2026, for Electrochemically Debondable Adhesive Film.
Inventors include Stricker, Lucas; Sweeney, Nigel; Huehnergarth, Philipp; Haberlin, Gavin; Stapf, Stefanie Number; and Mantout, Lola.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: The present disclosure is directed to a curable and electrochemically debondable film adhesive comprising: a) an ethylenically unsaturated monomer component, wherein said component comprises: a1) at least one (meth)acrylate-functionalized macromonomer; b) at least one radical generating initiator; c) at least on...